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Anatomical in-line lamp bead composition



LED lamp beads are mainly composed of five materials: bracket, silver glue, chip, gold wire, and epoxy resin.

Hilongxing Optoelectronics F5 Round Head Lamp Beads

  LED lamp bead bracket

1. The role of the bracket: conduction and support

2. The composition of the bracket: The bracket is formed by electroplating the bracket material, which is composed of five layers of material, copper, nickel, copper, and silver from the inside to the outside.

3. Types of brackets: Concentrating type with a cup bracket, wide-angle astigmatism type with a flat head bracket.

  LED lamp bead silver glue

1. The role of silver glue: to fix the chip and conduct electricity.

2. The main components of silver glue: silver powder accounts for 75-80%, EPOXY (epoxy resin) accounts for 10-15%, and additives account for 5-10%.

3. The use of silver glue: refrigerate, thaw and stir well before use, because the silver powder will precipitate after the silver glue is placed for a long time, if it is not stirred evenly, the performance of the silver glue will be affected.

  LED lamp bead chip

1. The role of the chip: the chip is the main component material of LED Lamp, and it is a luminous semiconductor material.

Hilongxing Optoelectronic Lamp Bead Chip

2. Chip composition: The chip is made of gallium phosphide (GaP), gallium aluminum arsenide (GaAlAs) or gallium arsenide (GaAs), gallium nitride (GaN) and other materials, and its internal structure has unidirectional conductivity.

3. Chip structure: Weld single wire positive polarity (P/N structure) wafer, double wire wafer. The size unit of the chip: mil, and the pads of the chip are generally gold pads or aluminum pads. The pad shapes are round, square, cross and so on.

4. The luminous color of the chip: The luminous color of the chip depends on the wavelength. The classification of common visible light is roughly: dark red (700nm), deep red (640-660nm), red (615-635nm), amber (600-610nm) , yellow (580-595nm), yellow-green (565-575nm), pure green (500-540nm), blue (450-480nm), purple (380-430nm).

White light and pink light are a mixed effect of light. The most common is a mixture of blue light + yellow phosphor and blue light + red phosphor.

5. The main technical parameters of the chip:

     a. The volt-ampere characteristic diagram of the chip;

     b. Forward voltage (VF): The voltage applied to both ends of the chip to make the chip conduct forward. This voltage has a corresponding relationship with the wafer itself and the test current. If VF is too large, the chip will be broken down.

     c. Forward current (IF): The forward conduction current generated by the chip after a certain voltage is applied. The size of IF is related to the size of the forward voltage. The working current of the chip is about 10-20mA.

     d. Reverse Voltage (VR): The reverse voltage applied to the wafer.

     e. Reverse current (IR): refers to a leakage current generated by the chip after the reverse voltage is applied. The smaller the current, the better. Because the current is too large, it is easy to cause the chip to be reversely broken down.

     f. Brightness (IV): Refers to the brightness of the light source. Unit conversion: 1cd=1000mcd

     g. Wavelength: Reflects the luminescent color of the chip. Chips with different wavelengths have different luminescent colors. Unit: nm

  LED lamp bead gold wire

1. The role of the gold wire: to connect the chip PAD (welding pad) and the bracket, and make it conduct.

The purity of the gold wire is 99.99% Au; the elongation is 2-6%, and the size of the gold wire is: 0.9mil, 1.0mil, 1.1mil, etc.

  LED lamp bead epoxy resin

1. The role of epoxy resin: to protect the internal structure of the Lamp, to slightly change the luminous color, brightness and angle of the Lamp; to shape the Lamp.

2. Encapsulation resin includes four parts: glue A (main agent), glue B (curing agent), DP (diffusion agent), and CP (colorant). Its main components are epoxy resin (Epoxy Resin), acid anhydrides (acid anhydrate Anhydride), high light diffusing filler (Light diffusion) and thermal stability dye (dye).

  LED lamp bead chip,  LED lamp bead silver glue


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